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4U10G-EGS2

Model4U10G-EGS2

4U Rackmount with 3+1, 80-PLUS Platinum, 2000W CRPS

Dual Socket E (LGA 4677), supports 5th and 4th Gen Intel? Xeon? Scalable Processors

16+16 DIMM slots (2DPC), supports DDR5 RDIMM, RDIMM-3DS

Remote Management (IPMI)

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Specifications

System
Form Factor 4U Rackmount
Dimensions 786 x 438 x 176.5 mm (30.9'' x 17.2'' x 6.9'')
Support MB SP2C741D32G-2L+
Front Panel
Buttons Power button w/ LED, Reset button, NMI button, UID button
LEDs System fault LED, HDD activity LED
I/O Ports

2 RJ45 (1GbE) by Intel i350, shares with Rear IO

1 dedicated IPMI, shares with Rear IO

4 Type-A (USB3.2 Gen1)

1 DB15 (VGA)
External Drive Bay / Storage
Front Side Drive Bay

16 hot-swap 2.5" NVMe (PCIe5.0 x4) drive bays, 2 hot-swap 2.5" NVMe (PCIe4.0 x4) drive bays,

8 hot-swap 2.5" SATA drive bays (2 shards with 2.5" NVMe)

16 Hot-swap 2.5" SATA/SAS* drive bays

*Additional RAID/HBA card required to support the 20 x 2.5" SATA/SAS drive bays
Front Side Backplane 24-port NVMe/SATA/SAS* passive backplanes *SAS drive is only supported with additional RAID/HBA cards
Internal Side

1 M-key (PCIe3.0 x4 or SATA 6Gb/s), supports 2280/22110 form factor [PCH]

1 M-key (PCIe3.0 x4), supports 2280/22110 form factor [PCH]
Power Supply
Type 3+1 CRPS
Output Watts 1000W @ 100-127Vac input / 2000W @ 200-240Vac input
Efficiency 80-PLUS Platinum
AC Input Low-line: 100-127Vrms, 47/63Hz ; High-line: 200-240Vrms, 47/63Hz
System Fan
Fan 5 Middle Hot-swap 80x80 mm fans
Processor System
CPU Supports 5th and 4th Gen Intel® Xeon® Scalable Processors
Socket Dual Socket E (LGA 4677)
Thermal Design Power Up to 400W
Chipset C741
System Memory
Supported DIMM Quantity 16+16 DIMM slots (2DPC)
Supported Type Supports DDR5 288-pin RDIMM, RDIMM-3DS
Max. Capacity per DIMM

RDIMM: 64GB (2R)

RDIMM-3DS: 512GB (2S8Rx4)
Max. DIMM Frequency

5600 MT/s (1DPC) / 4400 MT/s (2DPC) on 5th Gen Intel® Xeon® Scalable Processors

4800 MT/s (1DPC) / 4400 MT/s (2DPC) on 4th Gen Intel® Xeon® Scalable Processors

*Memory speed support varies by CPU SKU
Voltage 1.1V
PCIe Expansion Slots (SLOT7 close to CPU)
PCIe x 16

Rear:

10 FHFL dual-slot PCIe5.0 x16 (with PEX89104 PCIe Switch)

1 FHFL single-slot PCIe5.0 x16 (CPU direct link)

Front:

2 FHHL PCIe5.0 x16
PCIe x 8

Rear:

2 FHFL single-slot PCIe5.0 x8, shared space with adjacent dual-slot (with PEX89104 PCIe Switch)
Ethernet
Additional GbE Controller Intel® i350: 2 RJ45 (1GbE)
OCP slot 1 OCP NIC 3.0 (PCIe5.0 x16)
Server Management
BMC Controller ASPEED AST2600
IPMI Dedicated GLAN 1 Realtek RTL8211F for dedicated management GLAN
Graphics
Controller ASPEED AST2600
VRAM DDR4 512MB
Rear I/O
UID Button/LED 1 UID button
VGA Port 1 DB15 (VGA)
USB 3.2 Gen1 Port 2 Type-A (USB3.2 Gen1)
RJ45

2 RJ45 (1GbE) by Intel i350, shares with Front Panel

1 dedicated IPMI, shares with Front Panel
System BIOS
BIOS Type AMI UEFI BIOS; 256 Mb (32MB) SPI Flash ROM
BIOS Features

ASRock Rack Instant Flash, ACPI 6.4 and about compliance wake up events, SMBIOS 3.5.0 and above,

Plug and Play(PnP)
Hardware Monitor
Temperature CPU, MB, Card side Temperature Sensing
Fan

Fan Tachometer

CPU Quiet Fan (Allow Chassis Fan Speed Auto-Adjus
Voltage

P0_VDDCR_CPU0, P0_VDDCR_CPU1, P0_VDDCR_SOC, P0_VDD_18_DUAL, P0_VDD_11_S3, P0_VDDIO,

P1_VDDCR_CPU0, P1_VDDCR_CPU1, P1_VDDCR_SOC, P1_VDD_18_DUAL, P1_VDD_11_S3,

P1_VDDIO, +BAT, +12V, +3VSB, +5VSB
Environment
Temperature Operation temperature: 10°C ~ 35°C / Non operation temperature: -40°C ~ 70°C
Humidity Non operation humidity: 20% ~ 90% ( Non condensing)
Model 4U10G-EGS2

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